Chip structure with good heat dissipation capability and low thermal resistance

The utility model discloses a chip structure with good heat dissipation capability and low thermal resistance, which is characterized in that the chip structure comprises a chip body, the chip body comprises a light-emitting layer and a packaging layer arranged on the light-emitting layer, the light...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JIANG MING, XU MIN, HE TAOYING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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