Chip structure with good heat dissipation capability and low thermal resistance

The utility model discloses a chip structure with good heat dissipation capability and low thermal resistance, which is characterized in that the chip structure comprises a chip body, the chip body comprises a light-emitting layer and a packaging layer arranged on the light-emitting layer, the light-emitting layer comprises a light-emitting body layer and a matching shell fixedly wrapped on the outer side of the light-emitting body layer, and the light-emitting body layer is provided with a light-emitting layer. A P electrode layer and an N electrode layer are arranged on the side, located on the packaging layer, of the luminous body layer, a plurality of through holes are formed in the packaging layer in a penetrating mode, the through holes are filled with power-on heat conduction columns connected with the P electrode layer and the N electrode layer, and auxiliary heat dissipation columns are evenly embedded in the matched shell. The chip structure has the advantages that the heat dissipation plate and the