LED package

An LED package comprises a support and an LED chip, a silver coating is arranged on the surface of a functional area of the support, the LED chip is fixedly arranged in the functional area, a high-reflection plastic layer is arranged on the silver coating in a bowl cup, a first through hole is forme...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN DESHUN, WENG PING, CHEN HUAYUN, GUO SHENGSHU, YANG YONGFA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:An LED package comprises a support and an LED chip, a silver coating is arranged on the surface of a functional area of the support, the LED chip is fixedly arranged in the functional area, a high-reflection plastic layer is arranged on the silver coating in a bowl cup, a first through hole is formed in the position, corresponding to the LED chip, of the high-reflection plastic layer, and a second through hole is formed in the position, corresponding to a bonding pad, of the high-reflection plastic layer. And a fluorescent glue layer is arranged on the high-reflection plastic layer. According to the principle of the utility model, the high-reflection plastic layer is additionally arranged on the surface of the silver plating layer, the silver plating layer is covered with the high-reflection plastic layer, the silver plating layer can be prevented from being subjected to vulcanization reaction, the reflection efficiency of the silver plating layer is ensured, in addition, the reflection efficiency of the high