Semiconductor process equipment and bearing device thereof
The embodiment of the utility model provides semiconductor process equipment and a bearing device thereof. The bearing device comprises a tray, a cover plate and an insulating layer, a plurality of bearing tables are arranged on the upper surface of the tray and are used for bearing a plurality of w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the utility model provides semiconductor process equipment and a bearing device thereof. The bearing device comprises a tray, a cover plate and an insulating layer, a plurality of bearing tables are arranged on the upper surface of the tray and are used for bearing a plurality of wafers respectively; the cover plate covers the tray, a plurality of pressing parts are arranged on the cover plate, and the plurality of pressing parts are in contact with the edges of the plurality of wafers respectively; the insulating layer is arranged between the tray and the cover plate, and the top surface and the bottom surface of the insulating layer are attached to the tray and the cover plate respectively, so that the potential difference between the cover plate and the wafer is reduced. According to the embodiment of the invention, the potential difference between the wafer and the cover plate is reduced, the electric field distribution at the edge of the wafer is improved, and the electric field angle a |
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