Heat conduction pipe seamless splicing radiator for screen heat dissipation
The utility model discloses a heat conduction pipe seamless splicing radiator for heat dissipation of a screen, and particularly relates to the field of radiators, the heat conduction pipe seamless splicing radiator comprises a fixing mechanism and a radiator body, the fixing mechanism comprises a f...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a heat conduction pipe seamless splicing radiator for heat dissipation of a screen, and particularly relates to the field of radiators, the heat conduction pipe seamless splicing radiator comprises a fixing mechanism and a radiator body, the fixing mechanism comprises a first fixing rod, a second fixing rod and a fixing clamp, and the second fixing rod is fixedly installed on one side of the first fixing rod; compared with the prior art, through the structural design that the fixing mechanism comprises the first fixing rod, the second fixing rod and the fixing clamp, when the heat conduction pipe and the radiator are connected and installed, the heat conduction pipe body is fixed through the fixing mechanism after the heat conduction pipe is installed in the installation groove of the radiator body; the first fixing rod and the second fixing rod are fixedly pressed on the surfaces of the two ends of the Fu heat pipe correspondingly, the Fu heat pipe is fixed in the mounting groove |
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