Device for processing foreign matters on surfaces of chip packaging semi-finished products in large scale

The utility model relates to the technical field of semiconductor packaging, in particular to a device for processing foreign matters on the surfaces of chip packaging semi-finished products on a large scale, which comprises a working table for placing chips, a vacuum tube connected with the working...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG NONGKAI, YAO ZHIXIANG, YAO XU, YANG QIXUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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