Device for processing foreign matters on surfaces of chip packaging semi-finished products in large scale

The utility model relates to the technical field of semiconductor packaging, in particular to a device for processing foreign matters on the surfaces of chip packaging semi-finished products on a large scale, which comprises a working table for placing chips, a vacuum tube connected with the working table and a spray gun suspended on the working table, a cavity is formed in the workbench, an adsorption through hole communicated with the cavity is formed in the upper end of the workbench, one end of the vacuum pipe is communicated with the inner cavity of the workbench, the other end of the vacuum pipe is connected with a vacuum pump, the spray gun is connected with a nitrogen machine through a connecting pipe, and the chip is arranged on the adsorption through hole in the upper end of the workbench and is adsorbed and fixed to the workbench through the vacuum pump. The chip is fixed through negative pressure adsorption, cleaning is performed through nitrogen purging, the operation is simple, and the cleaning