GaN packaging chip structure and electronic device

The utility model relates to a GaN packaging chip structure and an electronic device, the GaN packaging chip structure comprises a lead frame, a GaN chip and a plastic package body, the lead frame comprises a heat dissipation slide, a first pin and two second pins, the first pin and the heat dissipation slide are integrally formed, and the two second pins are arranged on the two sides of the first pin; the GaN chip is arranged on the heat dissipation slide glass, a grid electrode of the GaN chip is electrically connected with the first pin, and a source electrode of the GaN chip and a drain electrode of the GaN chip are respectively and correspondingly connected with one second pin; and the plastic package body is fixedly arranged on the heat dissipation slide glass, seals the GaN chip, and is also fixedly connected with the second pin. The grid electrode of the GaN chip is connected with the first pin in the middle, so that the whole heat dissipation slide glass is connected with the ground wire in the using