Double-group Pu heat-conducting structural adhesive pouring equipment
The utility model discloses double-group Pu heat-conducting structural adhesive filling equipment, which relates to the technical field of adhesive filling equipment, and comprises a support frame, a U-shaped bracket is fixedly connected to the top of the support frame, a moving mechanism is arrange...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses double-group Pu heat-conducting structural adhesive filling equipment, which relates to the technical field of adhesive filling equipment, and comprises a support frame, a U-shaped bracket is fixedly connected to the top of the support frame, a moving mechanism is arranged in the U-shaped bracket, a cylinder is fixedly connected to the bottom of the moving mechanism, and a protective cover is fixedly connected to the output end of the cylinder. A mixing pipe is fixedly connected to the lower surface of the protective cover, a stirring mechanism is arranged in the mixing pipe, and a heating wire is fixedly connected to the interior of the mixing pipe. During use, through cooperation of the first feeding pipe and the second feeding pipe, different groups of structural adhesives are conveyed into the mixing pipe, and the stirring mechanism mixes the different structural adhesives in the mixing pipe; a heating wire is mounted in the mixing pipe, and the structural adhesive in the mixin |
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