Wafer warping adjusting jig

The utility model relates to the field of semiconductors, and particularly discloses a wafer warping adjusting jig, which comprises a base plate and a gland matched with the base plate, a cavity for placing a wafer is arranged on the base plate, and a pressing structure which can be embedded into the cavity and is used for applying pressure to the edge of the wafer is arranged on the lower surface of the gland. And the bottom surface of the cavity is provided with a supporting structure which protrudes outwards towards one side close to the gland. According to the scheme, the supporting structure protrudes outwards towards one side close to the gland, so that the edge of the wafer generates slight reverse warping under the downward pressing action of the downward pressing structure, and after the wafer is taken out and cooled, the slight reverse warping at the edge of the wafer can reduce the rebound rate of upward warping at the edge of the wafer, so that the yield of the wafer is improved. Therefore, the co