Welding mechanism for high-thermal-conductivity metal substrate mold

The utility model discloses a welding mechanism for a high-thermal-conductivity metal substrate mold, and relates to the technical field of protective fences, in particular to the welding mechanism for the high-thermal-conductivity metal substrate mold. The welding mechanism comprises a support, and...

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Bibliographische Detailangaben
Hauptverfasser: MORIMOTO KOICHI, PIAO ZAIFENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a welding mechanism for a high-thermal-conductivity metal substrate mold, and relates to the technical field of protective fences, in particular to the welding mechanism for the high-thermal-conductivity metal substrate mold. The welding mechanism comprises a support, and a fixing column is welded to the top of one end of the support; the fixing column penetrates through the support and is fixedly welded to the fixing clamp at the bottom of the support. One end of the fixing clamp is sleeved with a third forceps holder, and the other end of the fixing clamp is sleeved with a fourth forceps holder; the end, away from the fixing clamp, of the third clamp is sleeved with a second clamp, and the end, away from the fixing clamp, of the fourth clamp is sleeved with a first clamp. The first forceps holder is sleeved with a first welding rod, and the second forceps holder is sleeved with a second welding rod. When the high-thermal-conductivity metal substrate mold welding platform is used,