Low stray inductance busbar structure for power module
The utility model discloses a low stray inductance busbar structure for a power module, which comprises a plastic casing, an anode busbar, a cathode busbar, a copper-clad ceramic substrate, a radiator and a crystal source, the crystal source is welded on the copper-clad ceramic substrate, the copper...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a low stray inductance busbar structure for a power module, which comprises a plastic casing, an anode busbar, a cathode busbar, a copper-clad ceramic substrate, a radiator and a crystal source, the crystal source is welded on the copper-clad ceramic substrate, the copper-clad ceramic substrate is welded on the radiator, the plastic casing is fixed on the radiator, and the anode busbar is fixed on the plastic casing. The positive busbar and the negative busbar are fixed on the copper-clad ceramic substrate through ultrasonic bonding, are fixed together with the plastic shell through injection molding, are arranged in parallel in a laminated manner at intervals, and are perpendicular to the copper-clad ceramic substrate; and the positive busbar and the negative busbar extend to the upper part of the copper-clad ceramic substrate from the external terminal of the plastic shell. The structure overcomes the defects of a traditional power module busbar structure, and by optimizing the b |
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