LED chip
The utility model provides an LED chip, which is characterized in that a substrate is provided with a plurality of bulges and a plane is formed between every two adjacent bulges, so that a first transparent conductive layer is arranged on the surface of each bulge; the graphical interface of the sub...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model provides an LED chip, which is characterized in that a substrate is provided with a plurality of bulges and a plane is formed between every two adjacent bulges, so that a first transparent conductive layer is arranged on the surface of each bulge; the graphical interface of the substrate is made of a transparent material different from that of the substrate, so that a better reflector structure can be formed; furthermore, the first electrode is electrically connected with the first transparent conductive layer, so that the substrate has a conductive graphical interface, and the first electrode is electrically connected with the first transparent conductive layer, so that good current expansion can be formed at the bottom of the light-emitting structure. On the basis, the first type semiconductor layer can be thinned, and the luminous efficiency is effectively improved while the cost is saved.
本实用新型提供了一种LED芯片,通过将衬底设置具有多个凸起且相邻凸起之间形成平面,从而在所述凸起的表面设置第一透明导电层;通过将衬底的图形界面设置为与衬底不同的透明材料,可形成更佳的反射镜结构;进一步 |
---|