Anti-pad structure for optimizing high-speed via hole of PCB (Printed Circuit Board)

The utility model discloses an anti-pad structure for optimizing PCB high-speed via holes, which is arranged in any layer of a PCB and comprises a rectangular hollow area with the length of (X + 18) mil and the width of (X + 67) mil, the rectangular hollow area is formed by taking the midpoint of a circle center connecting line of two adjacent high-speed differential signal via holes as the center, X is the aperture of the high-speed differential signal via holes, and the width of the rectangular hollow area is (X + 67) mil. And increasing the width of the wire entering the hollow area to 10mil, and arranging a protruding transition surface extending to the hollow area on a reference surface where the wire is located. According to the utility model, impedance abrupt change of the high-speed signal layer-changing via hole can be reduced, so that high-speed signal impedance matching is realized, reflection of signals in the via hole is reduced, and signal quality is improved; wiring entering a hollowed-out area