Circuit board packaging and counting die

The utility model provides a circuit board packaging counting die which comprises a base, the base comprises a plurality of epoxy resin plates which are arranged in a stacked mode and connected through pins, through holes are formed in the corresponding positions of the epoxy resin plates except the epoxy resin plate on the bottommost layer, and the epoxy resin plates are arranged in the through holes. And the plurality of through holes jointly form a placing groove for placing a plurality of circuit boards. When the circuit board packaging box is used, a plurality of circuit boards are vertically and fully placed in the placing grooves, the number of the correspondingly placed circuit boards can be known, meanwhile, the circuit boards can be arranged well and directly packaged, and the problem that a small number or a large number of circuit boards are packaged is avoided. 本实用新型提供了一种电路板包装计数模具，包括：基座，所述基座包括多个层叠设置的环氧树脂板，所述多个环氧树脂板通过销钉连接，除最底层的环氧树脂板以外的其他环氧树脂板的对应位置处上设置有通孔，多个所述通孔共同形成用于放置多个电路板的放置槽。本实用新型在使用时，将多块电路板竖直放