Heat dissipation device of integrated circuit chip

The utility model discloses a heat dissipation device of an integrated circuit chip, which comprises a chip body and a mounting shell used for bearing the chip body, a plurality of connecting pipes are fixedly arranged in the mounting shell, the inner threads of the connecting pipes are connected wi...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ZENG YAOHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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