Heat dissipation device of integrated circuit chip

The utility model discloses a heat dissipation device of an integrated circuit chip, which comprises a chip body and a mounting shell used for bearing the chip body, a plurality of connecting pipes are fixedly arranged in the mounting shell, the inner threads of the connecting pipes are connected with connecting screws, the chip body is fixedly arranged with the mounting shell through the connecting screws, and the chip body is fixedly connected with the mounting shell through the connecting screws. A plurality of heat dissipation plates are evenly and fixedly installed on the bottom wall of the installation shell, a V-shaped heat dissipation groove plate is fixedly installed on the bottom wall of the installation shell, and the V-shaped heat dissipation groove plate and the end faces of the heat dissipation plates are fixedly installed. According to the utility model, the heat dissipated by the chip body is adsorbed through the plurality of heat dissipation plates, so that the heat dissipation fan introduces