Rack for laser processing and cutting device

The utility model relates to a rack for laser processing and a cutting device, which comprise a rack body, a plurality of cutting heads, a plurality of cutting heads, a plurality of cutting heads and a plurality of cutting heads, the cooling device, the power supply device and the air supply device...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YU SHUANGXI, WANG WENXUE, CHENG WUSI, CAI FUYUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to a rack for laser processing and a cutting device, which comprise a rack body, a plurality of cutting heads, a plurality of cutting heads, a plurality of cutting heads and a plurality of cutting heads, the cooling device, the power supply device and the air supply device are all arranged in the containing cavity and fixedly connected with the inner wall of the containing cavity, and the cooling device, the power supply device and the air supply device all communicate with the connector; and the separator is positioned in the accommodating cavity and is arranged between the cooling device and the power supply device. The cooling device, the power supply device and the air supply device are arranged in the rack body, so that space is effectively saved, and meanwhile, rack transportation and on-site installation are facilitated. 本实用新型涉及一种用于激光加工的机架及切割装置,包括:架体,包围形成容纳腔,且具有与容纳腔连通的接口;冷却装置,供电装置和供气装置,均设置于容纳腔内,并与容纳腔的内壁固定连接,且冷却装置,供电装置和供气装置均与接口连通;隔离件,位于容纳腔内,设置在冷却装置和供电装置之间。通过将冷却装置,供电装置和供气装置设置在架体