Dispensing device for semiconductor component
The utility model discloses a dispensing device for a semiconductor component, and relates to the technical field of component processing devices. The device comprises a first circular gear and a second circular gear, the first circular gear and the second circular gear are distributed over a circul...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a dispensing device for a semiconductor component, and relates to the technical field of component processing devices. The device comprises a first circular gear and a second circular gear, the first circular gear and the second circular gear are distributed over a circular plate in an annular array mode, the first circular gear is connected with the second circular gear in a meshed mode, and the upper side of the first circular gear and the upper side of the second circular gear are both connected with upper opening groove bases. A first rotating shaft on the upper side of the first motor penetrates through the circular plate, and the upper side of the first rotating shaft is connected with a circular block. According to the adhesive dispensing device for the semiconductor components, the first circular gear and the second circular gear are arranged, so that an adhesive dispensing gun on the adhesive dispensing device for the semiconductor components can conveniently dispense adhe |
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