PCBA board assembly with thermal stress resistance

The utility model discloses a PCBA board assembly with thermal stress resistance, which comprises a base material board, a central processing chip is soldered on the right side of the base material board, and circuit elements matched with the central processing chip are soldered on the periphery of the top of the base material board; a thermal stress resistant structure is arranged at the top of the base material plate, the thermal stress resistant structure is formed by matching the main frame, the arc-shaped frame, the long straight cylinder, the short straight cylinder, the expansion circular groove, the long rod, the short rod, the support and the claw disc, and the main frame, the arc-shaped frame, the long rod, the short rod, the support and the claw disc are all made of memory metal materials. According to the characteristics of high-temperature expansion and low-temperature recovery of the memory metal material, stress generated by heat on the base material plate is supported and counteracted, the bas