Metallic bond diamond grinding wheel with symmetrically distributed chip grooves

The metallic bond diamond grinding wheel comprises an iron base body and a working layer, a center hole is formed in the middle of the iron base body, a plurality of fixing holes are formed in the periphery of the outer side of the center hole at equal intervals, and the working layer is installed on the front face of the iron base body. The working layer is composed of abrasive particles, metallic bond powder and lubricating pore-forming materials, the chip grooves are formed in the end face of the working layer, compared with an edge grinding wheel of a common specification, the width of the section of the working layer of the metallic bond diamond grinding wheel with the chip grooves symmetrically distributed is increased to 16 mm, the grinding amount can be increased due to increase of the width, and the service life of the grinding wheel is prolonged. Meanwhile, the 36 chip grooves are symmetrically distributed in the surface of the working layer, blockage of the grinding face of the grinding wheel is re