High-frequency multilayer circuit board based on mobile phone communication

The utility model relates to the field of circuit board manufacturing, and discloses a high-frequency multilayer circuit board based on mobile phone communication, which comprises a heat dissipation frame, two connecting blocks are fixedly arranged on two sides of the upper end of the heat dissipation frame, connecting nuts are arranged in the middles of the interiors of the four connecting blocks in a penetrating manner, a waterproof frame is fixedly sleeved in the heat dissipation frame, and the waterproof frame is fixedly connected with the waterproof frame. An insulating frame is fixedly arranged in the waterproof frame in a sleeving manner, cement layers are fixedly arranged at the top and the bottom of the insulating frame, signal enhancement layers are fixedly arranged at the opposite ends between the two cement layers, and heat dissipation copper plates are fixedly arranged at the opposite ends between the two signal enhancement layers; insulating silicon wafers are fixedly arranged at the opposite en