Wafer film expanding device
The utility model relates to the technical field of wafer production, in particular to a wafer film expanding device, which comprises a base, a wafer supporting plate, a film expanding plate, a jacking driving mechanism, a pressing plate and a pressing driving mechanism, the wafer supporting plate i...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of wafer production, in particular to a wafer film expanding device, which comprises a base, a wafer supporting plate, a film expanding plate, a jacking driving mechanism, a pressing plate and a pressing driving mechanism, the wafer supporting plate is fixed on the base, the jacking driving mechanism is fixed on the bottom surface of the wafer supporting plate, and the film expanding plate is connected with the jacking driving mechanism; a film expanding hole matched with the film expanding plate is formed in the wafer supporting plate; the pressing plate is arranged above the wafer supporting plate, the pressing plate is connected with the downward pressing driving mechanism, and an avoiding hole for avoiding the film expanding plate is formed in the pressing plate. According to the utility model, after a wafer product is placed at a designated position on the wafer supporting plate, the pressing plate is driven by the pressing-down driving mechanism to press |
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