Automatic wafer feeding device
The utility model relates to the technical field of wafer production, in particular to an automatic wafer feeding device which comprises a bottom plate, a feeding mechanism, an X-axis initial positioning mechanism, a Y-axis initial positioning mechanism and a carrying mechanism, the feeding mechanis...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of wafer production, in particular to an automatic wafer feeding device which comprises a bottom plate, a feeding mechanism, an X-axis initial positioning mechanism, a Y-axis initial positioning mechanism and a carrying mechanism, the feeding mechanism is arranged on one side of the bottom plate, the X-axis initial positioning mechanism, the Y-axis initial positioning mechanism and the carrying mechanism are all arranged on the bottom plate, and the X-axis initial positioning mechanism, the Y-axis initial positioning mechanism and the carrying mechanism are arranged on the bottom plate. The X-axis initial positioning mechanism and the Y-axis initial positioning mechanism are both located between the feeding mechanism and the carrying mechanism. Before a wafer product is carried to a detection station, the wafer product is primarily positioned in the X-axis direction and the Y-axis direction through the X-axis primary positioning mechanism and the Y-axis primary |
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