Wiring layer structure

The utility model provides a wiring layer structure. The wiring layer structure comprises a first dielectric layer to an Nth dielectric layer which are sequentially and vertically stacked, n is an integer greater than or equal to 2; the through groove penetrates through the first dielectric layer to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LIU XIN, DING XIAOCHUN, GUO LIANGKUI, LIANG XINFU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model provides a wiring layer structure. The wiring layer structure comprises a first dielectric layer to an Nth dielectric layer which are sequentially and vertically stacked, n is an integer greater than or equal to 2; the through groove penetrates through the first dielectric layer to the Nth dielectric layer; and the characteristic conductive column comprises an integrated characteristic conductive body which extends from the through groove in the first dielectric layer to the through groove in the Nth dielectric layer. According to the utility model, reliability test failure is avoided, and the service life is prolonged. 本实用新型提供一种布线层结构,包括:依次垂直层叠的第一介质层至第N介质层;N为大于或等于2的整数;贯通第一介质层至第N介质层的通槽;位于通槽中的特征导电柱,特征导电柱包括自第一介质层中的通槽至第N介质层中的通槽延伸的一体化的特征导电本体。本实用新型避免可靠性测试失效且提高了使用寿命。