Miniature heat dissipation device for computer chip
The utility model discloses a miniature heat dissipation device for a computer chip, which relates to the field of computer systems and comprises a frame and a chip body, rubber column grooves are arranged at the bottoms of two sides of the frame, annular rubber columns are connected in the rubber c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a miniature heat dissipation device for a computer chip, which relates to the field of computer systems and comprises a frame and a chip body, rubber column grooves are arranged at the bottoms of two sides of the frame, annular rubber columns are connected in the rubber column grooves, pin guide grooves are arranged at one ends of two sides of the frame provided with the rubber columns, and the pin guide grooves are connected with the rubber columns. The frame is connected with an insertion plate on one side of the two groups of insertion pin guide grooves, and the insertion plate is connected with insertion pins matched with the rubber columns. According to the utility model, the contact pins are inserted into the rubber columns to enable the rubber columns to extrude the chip, and the rubber columns on the two sides extrude and clamp the chip, so that the frame is fixed on the chip, the installation speed of the heat dissipation device is greatly improved, the two groups of conta |
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