Ceramic and metal integrated packaging structure

The utility model discloses a ceramic and metal integrated packaging structure in the field of electronic component packaging, which comprises a first ceramic substrate, a metal ring frame is mounted on the upper surface of the first ceramic substrate, a cover plate is connected above the metal ring frame in a sealing manner, a boss extends inwards from the inner wall of the metal ring frame, and the inner wall of the metal ring frame is provided with a second ceramic substrate. The upper surface and the lower surface of the boss are respectively provided with a second ceramic substrate and a metal carrier plate, and the second ceramic substrate and the first ceramic substrate are respectively provided with a signal circuit and a power circuit. According to the utility model, the ceramic-metal integrated tube shell design is adopted, so that the problems of large size and high weight of traditional metal packaging are solved; the first ceramic substrate and the second ceramic substrate are designed in an up-a