Self-dredging exhaust structure for semiconductor packaging mold

The utility model discloses a self-dredging exhaust structure for a semiconductor packaging mold, which belongs to the field of semiconductor molds, and comprises a lower mold base, a packaging cover plate is arranged on the upper side of the lower mold base, a placing groove is formed in the upper end of the lower mold base, an injection port is formed in the packaging cover plate, and the injection port is communicated with the packaging cover plate. A placement groove is formed in the lower die base, an anti-sticking base plate is arranged in the placement groove, the outer end of the anti-sticking base plate is in close contact with the inner wall of the placement groove, two exhaust pipes are embedded in the lower die base, and the two exhaust pipes are communicated with the interior of the placement groove and the outer side of the lower die base respectively. By means of temperature changes, the memory torsional spring is twisted, the magnetic ball and the magnet block are made to repel each other, the