Heat insulation and conduction floor heating module
The utility model relates to the field of floor heating, in particular to a heat insulation and conduction floor heating module. The utility model relates to a heat-insulating heat-conducting aluminum-plated plate which comprises a heat-insulating layer, a heat-conducting layer and an aluminum-plate...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the field of floor heating, in particular to a heat insulation and conduction floor heating module. The utility model relates to a heat-insulating heat-conducting aluminum-plated plate which comprises a heat-insulating layer, a heat-conducting layer and an aluminum-plated layer, the upper surface of the heat-insulating layer is bonded with the heat-conducting layer through a binder, the upper surface of the heat-conducting layer is bonded with the aluminum-plated layer through the binder, and the upper surface of the aluminum-plated layer is provided with groove marks. The beneficial effects are that heat loss can be effectively blocked, and heat transfer is more uniform due to the arrangement of the aluminized layer.
本实用新型涉及地暖领域,尤其是一种隔热导热地暖模块。其包括保温层、导热层、镀铝层,所述保温层上表面通过粘结剂与所述导热层粘接,所述导热层上表面通过所述粘结剂与所述镀铝层粘接,所述镀铝层上表面设置有槽痕。它的有益效果在于:有效阻隔热量散失,镀铝层的设置使得热量传递更加均匀。 |
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