Non-contact upper and lower chip packaging structure

The utility model discloses a non-contact upper and lower chip packaging structure, which comprises a packaging box and a packaging cover, the upper end of the packaging box is fixedly connected with a baffle plate, the left part and the right part of the upper end of the baffle plate are fixedly connected with fixing mechanisms, the lower inner wall of the packaging box is provided with a first chip, and the lower inner wall of the packaging box is provided with a second chip. Two clamping mechanisms are fixedly connected to each of the front inner wall and the rear inner wall of the packaging box, a substrate is jointly clamped between the four clamping mechanisms, a second chip is arranged at the upper end of the substrate, a plurality of pins are fixedly connected to each of the left end and the right end of the packaging box, clamping blocks are fixedly connected to the middle of the left end and the middle of the right end of the packaging cover, and clamping grooves are formed in the clamping blocks. T