High-strength composite multilayer 5G PCB (Printed Circuit Board)
The utility model relates to the technical field of circuit boards, in particular to a high-strength composite multilayer 5G PCB (printed circuit board), which comprises a circuit board body, the circuit board body comprises a copper template end layer, a first mirror stainless steel layer is arrang...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The utility model relates to the technical field of circuit boards, in particular to a high-strength composite multilayer 5G PCB (printed circuit board), which comprises a circuit board body, the circuit board body comprises a copper template end layer, a first mirror stainless steel layer is arranged on the lower side of the copper template end layer, a first base layer is arranged on the lower side of the first mirror stainless steel layer, and a second base layer is arranged on the lower side of the first base layer. A first prepreg layer is arranged on the lower side of the first base layer, a second base layer is arranged on the lower side of the first prepreg layer, a second prepreg layer is arranged on the lower side of the second base layer, a second mirror stainless steel layer is arranged on the lower side of the second prepreg layer, and a copper template bottom layer is arranged on the lower side of the second mirror stainless steel layer. Through the first mirror surface stainless steel layer and |
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