Chip structure

The utility model provides a chip structure which comprises an epitaxial structure, the epitaxial structure comprises a first type semiconductor layer, an active layer, a second type semiconductor layer and a transparent conductive layer which are stacked in sequence, a first electrode and a second electrode are arranged on the side, away from the active layer, of the first type semiconductor layer, the first electrode is connected with the first type semiconductor layer, and the second electrode is connected with the second type semiconductor layer; the second electrode is connected with the transparent conducting layer, and an insulating structure is arranged between the first electrode and the second electrode in the direction parallel to the surface of the first type semiconductor layer, so that the first electrode and the second electrode are insulated. By arranging the insulating structure, the risk of chip electrode short circuit can be reduced, and the reliability of the chip is improved. 本申请提供了一种芯片结构