Airtight packaging differential capacitance accelerometer signal detection circuit housing
The utility model discloses an airtight packaging differential capacitance accelerometer signal detection circuit housing, comprising a ceramic substrate which is provided with a cavity and can be subjected to airtight packaging and a matched metal base, the ceramic substrate comprises a ceramic sub...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses an airtight packaging differential capacitance accelerometer signal detection circuit housing, comprising a ceramic substrate which is provided with a cavity and can be subjected to airtight packaging and a matched metal base, the ceramic substrate comprises a ceramic substrate and a sealed ceramic cavity integrated with the ceramic substrate, the ceramic cavity is arranged at the central position of the ceramic substrate, a gold conduction band is arranged on the surface of the ceramic substrate, components are assembled by adopting a welding process or a gluing process, electrical interconnection among the components, the pins and the gold conduction band is realized by using bonding wires, and the ceramic cavity is provided with a metal seal welding ring for airtight packaging; the metal base comprises metal pins and a base body, and is sealed, fixed and insulated through glass insulators or ceramics. According to the utility model, the mechanical strength is high, the cracking |
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