Electronic component, function module and electronic equipment

The embodiment of the utility model discloses an electronic element, a function module and electronic equipment. The electronic component comprises a first conducting layer and a second conducting layer which are oppositely arranged, and injection molding layers which are arranged on the edge area of the first conducting layer and the edge area of the second conducting layer and used for fixing the first conducting layer and the second conducting layer. The vertical projection of the edge area of the first conducting layer on the second conducting layer is at least partially not overlapped with the edge area of the second conducting layer. According to the technical scheme provided by the embodiment of the utility model, the bonding strength between the injection molding layer and the first conductive layer and the second conductive layer is enhanced, and the problem that the bonding strength between the injection molding material of the electronic component and the conductive layers such as a copper bar is l