Photosensitive assembly

The utility model provides a photosensitive assembly, which is characterized in that N photosensitive chips are arranged in a rectangular chip bearing area on the front surface of a substrate, gaps are arranged among the photosensitive chips, and the projection area s of a single photosensitive chip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEI DONGHAN, SUN PINGRU, YANG ZHENGGUAN, SU HONGBO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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