Photosensitive assembly

The utility model provides a photosensitive assembly, which is characterized in that N photosensitive chips are arranged in a rectangular chip bearing area on the front surface of a substrate, gaps are arranged among the photosensitive chips, and the projection area s of a single photosensitive chip in the rectangular chip bearing area is smaller than one Nth of the area S of the rectangular chip bearing area, in the embodiment, a plurality of small-size photosensitive chips are used for replacing an existing large-size photosensitive chip under the same rectangular chip bearing area, and gaps are formed between the photosensitive chips, so that when the light-transmitting packaging glue layer is arranged on the front surface of the substrate, the light-transmitting packaging glue layer covers the gaps between the photosensitive chips, and the light-transmitting packaging glue layer is not prone to falling off. Namely, the light-transmitting packaging adhesive layer can be divided into a plurality of areas wh