Multi-layer circuit board curing device

The utility model provides a multilayer circuit board curing device. The multilayer circuit board curing device comprises a hot pressing part, a cooling part and a discharging mechanism which are sequentially arranged along the circumference. The device further comprises a rotating frame, at least three material frames are arranged on the rotating frame along the circumference and used for installing overlapped circuit boards, the rotating frame is rotationally arranged among the hot-pressing component, the cooling component and the discharging mechanism, and when the circuit board in one material frame is located at the hot-pressing component, the other two material frames are located at the cooling component and the discharging mechanism respectively. Hot pressing plates are arranged above and below the hot pressing part corresponding to the material frame, the cooling part is provided with a fan, and a liftable top plate is arranged at the bottom of the discharging mechanism corresponding to the material f