Silicon wafer thickness measuring device
The utility model discloses a silicon wafer thickness measuring device, and relates to the technical field of silicon wafer production equipment. The silicon wafer thickness measuring device comprises a fixing plate, a conveying mechanism used for conveying silicon wafers is installed on one side of...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model discloses a silicon wafer thickness measuring device, and relates to the technical field of silicon wafer production equipment. The silicon wafer thickness measuring device comprises a fixing plate, a conveying mechanism used for conveying silicon wafers is installed on one side of the top of the fixing plate, a supporting frame is fixed to the other side of the top of the fixing plate, a fixing shell is fixed to one side of the top end of the supporting frame, and a detecting mechanism used for measuring the thickness of the silicon wafers is installed in the fixing shell. And the detection mechanism comprises a connecting plate, a lifting driving motor, a rotating disc, a first connecting rod, a warning lamp, a displacement sensor and a second connecting rod. According to the utility model, through cooperation of the connecting plate, the rotating disc, the displacement sensor and the second connecting rod, the detection tool can efficiently detect the thickness of a silicon wafer during u |
---|