SEMICONDUCTOR PACKAGE DEVICE

The embodiment of the utility model provides a semiconductor packaging device, and the device comprises a first line layer which is provided with a first signal bonding pad and a second signal bonding pad, the second signal bonding pad is adjacent to the edge of the first line layer, and the first signal bonding pad is farther from the edge of the first line layer than the second signal bonding pad; the second circuit layer is arranged on the first circuit layer, the second circuit layer is provided with a first grounding layer, the first grounding layer is provided with openings corresponding to the first signal bonding pad and the second signal bonding pad, the opening corresponding to the first signal bonding pad is provided with a first supporting structure, and the first supporting structure is provided with an opening. 本申请实施例提供了一种半导体封装装置，包括：第一线路层，设置有第一信号焊盘和第二信号焊盘，第二信号焊盘邻近第一线路层边缘，第一信号焊盘相较第二信号焊盘远离第一线路层边缘；第二线路层，设置于第一线路层上，第二线路层设置有第一接地层，第一接地层对应第一信号焊盘和第二信号焊盘设置有开口，对应第一信号焊盘的开口设置有第一支撑结构，第一支撑结构具有开孔。