Semiconductor packaging structure

According to the semiconductor packaging structure provided by the invention, the electronic component and the substrate are fixed by using the adhesive material, and the structural strength is enhanced, so that the stress generated between the electronic component and the substrate in a thermal process can be overcome, and the breakage of an interconnection structure between the electronic component and the substrate is avoided. 本申请提供的半导体封装结构，利用胶材固定电子元件与基板，辅以增加结构强度，从而可以克服热制程中电子元件与基板间产生的应力，避免电子元件与基板间的互连结构断裂。