Chemical mechanical planarization equipment

The utility model discloses chemical mechanical planarization equipment, which comprises a grinding pad arranged on a rotary table; the grinding head is used for driving the wafer to rotate on the grinding pad so as to grind the surface of the wafer; the grinding fluid conveying arm comprises a grin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	DING XIANAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The utility model discloses chemical mechanical planarization equipment, which comprises a grinding pad arranged on a rotary table; the grinding head is used for driving the wafer to rotate on the grinding pad so as to grind the surface of the wafer; the grinding fluid conveying arm comprises a grinding fluid conveying pipe with an outlet and is used for conveying grinding fluid to the grinding pad; the cooling unit is used for reducing the temperature of the grinding fluid in the grinding fluid conveying pipe; the heating unit is used for increasing the temperature of the grinding fluid in the grinding fluid conveying pipe; and the regulation and control unit is used for at least monitoring the temperature of the grinding pad and the temperature of the grinding fluid in the grinding fluid conveying pipe, so that the temperature of the grinding pad and the temperature of the grinding fluid at the outlet of the grinding fluid conveying pipe tend to be the same through regulation of the cooling unit and/or the