Wafer bearing device

The utility model belongs to the technical field of wafer production, and particularly relates to a wafer bearing device which comprises a bearing seat. A plurality of groups of telescopic ejector pins are mounted at the top of the bearing seat, and are arranged in the bearing seat; the top end of the telescopic thimble is fixedly connected with a tray; the middle part of the tray is sunken; the tray is arranged at the top of the telescopic ejector pin, the contact area of the telescopic ejector pin for supporting the wafer can be increased, meanwhile, the recess is formed in the tray, impurities can fall into the tray, the problem of accumulation between the tray and the wafer is reduced, the stability of the telescopic ejector pin for supporting the wafer is improved, and the service life of the wafer is prolonged. And the problem that the wafer is scratched at the top of the telescopic ejector pin is reduced. 本实用新型属于晶圆生产技术领域，具体的说是晶圆承载装置，包括承载座；所述承载座顶部安装有伸缩顶针，所述伸缩顶针在承载座内部设有多组；所述伸缩顶针顶端固接有托盘；所述托盘中部为凹陷设置；通过将伸缩顶