Wafer electroplating equipment with flushable wafer

The utility model relates to the field of wafer processing, in particular to wafer electroplating equipment capable of flushing wafers, which comprises a cabinet body, a flushing spray pipe is fixedly connected on the inner side wall of a flushing tank, the end surface of a flushing spray head is flush with the inner side wall of the flushing tank, and the water spraying direction of the flushing spray head is inclined downwards; the executing mechanism is used for taking out the wafer disc from the electroplating tank and putting the wafer disc into the flushing tank; the wafer is slowly placed in the electroplating tank through the executing mechanism, and after the wafer is electroplated, the wafer disc is slowly lifted up through the executing mechanism and is slowly placed in the flushing tank, so that the wafer is directly flushed and cleaned after being electroplated, impurities on the surface of the wafer disc are cleaned in time, and then the wafer disc is transported to a designated place through th