Substrate transfer device

The utility model discloses a substrate transfer device, which can comprise a lower insulating layer, an upper insulating layer and an upper insulating layer, an upper insulating layer disposed on the lower insulating layer; a plurality of conductive layers disposed between the lower insulating layer and the upper insulating layer; and a plurality of holes defined from an upper surface of the upper insulating layer to a predetermined portion of the lower insulating layer and not overlapping the conductive layer. 本实用新型公开了一种基板移送装置，其可以包括：下部绝缘层；上部绝缘层，布置在所述下部绝缘层上；多个导电层，布置在所述下部绝缘层与所述上部绝缘层之间；以及多个孔，从所述上部绝缘层的上表面限定到所述下部绝缘层的预定的部分，并且不与所述导电层重叠。