Wide cover edge ring for enhanced shielding in substrate processing systems

A wide cover edge ring configured to be disposed over a bottom ring in a substrate processing chamber includes: an upper surface; a lower surface including a lower surface step extending downwardly from the lower surface and configured to be received within and interfaced with a recess defined at least in part by an upper surface of the bottom ring and an inner surface of a chamber liner; a boss is limited in the inner diameter of the edge ring; and an outer diameter. The outer diameter of the edge ring includes a protrusion extending radially outward from the edge ring and defining an inward step in the outer diameter, the protrusion and the inward step configured to interface with an upper end of the chamber liner, and the protrusion configured to extend at least partially over the upper end of the chamber liner. 一种被配置为布置在衬底处理室中的底部环上方的宽覆盖边缘环包括：上表面；下表面，其包括下表面台阶，所述下表面台阶从所述下表面向下延伸，并且被配置为被容纳在至少部分地由所述底部环的上表面和室衬里的内表面限定的凹部内并与所述凹部对接；内径，所述边缘环的所述内径中限定有凸台；以及外径。所述边缘环的所述外径包括从所述边缘环径向向外延伸并在所述外径中限定向内台阶的突出部，所述突出部和所述向内台阶被配置成