Bonding forming device suitable for A-type datura ringback

The utility model discloses a bonding forming device suitable for A-type datura bell loop, which comprises a rack assembly, a bearing frame, a loop upper die mechanism, a loop lower die mechanism and a control device, the loop lower die mechanism is arranged in the center of the top of the rack asse...

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1. Verfasser: LING JIANCONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a bonding forming device suitable for A-type datura bell loop, which comprises a rack assembly, a bearing frame, a loop upper die mechanism, a loop lower die mechanism and a control device, the loop lower die mechanism is arranged in the center of the top of the rack assembly, the loop upper die mechanism is arranged behind the loop lower die mechanism in a suspended manner through the bearing frame, and the control device is arranged on the bearing frame. The wire returning upper die mechanism is located over the wire returning lower die mechanism, positive pressure drives are arranged in front of and behind the wire returning lower die mechanism respectively, positive pressure plates pointing to the wire returning lower die mechanism are arranged on the positive pressure drives respectively, and side pressure drives are arranged at the left end and the right end of the wire returning lower die mechanism respectively. Each side pressing drive is provided with a side pressing plate