Multistage voltage regulating mechanism of circuit board

The utility model discloses a multistage pressure regulating mechanism of a circuit board, which comprises a top plate, side plates are arranged on both sides of the lower surface of the top plate, the bottom ends of the side plates are arranged on the upper surface of a base, a hydraulic cylinder is arranged in the center of the upper surface of the top plate, and a hydraulic telescopic rod is arranged at the bottom of the hydraulic cylinder. And the other end of the hydraulic telescopic rod penetrates through the first through hole to be connected with a first mounting plate, an upper mold is mounted in the center of the lower surface of the first mounting plate, connecting rods are mounted on the outer walls of the two sides of the first mounting plate, and sleeves are mounted at the other ends of the connecting rods. The circuit board stamping device solves the problem that an existing circuit board stamping device is inconvenient to adjust stamping pressure. According to the utility model, the stamping p