PCBA (printed circuit board assembly) low-pressure injection molding device
The utility model discloses a PCBA (printed circuit board assembly) low-pressure injection molding device which comprises a bearing plate, an extrusion air cylinder is arranged at the upper end of the bearing plate, a feeding pipe is arranged at the bottom end of the extrusion air cylinder, a lower...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a PCBA (printed circuit board assembly) low-pressure injection molding device which comprises a bearing plate, an extrusion air cylinder is arranged at the upper end of the bearing plate, a feeding pipe is arranged at the bottom end of the extrusion air cylinder, a lower mold frame is arranged at the position, located at the lower end of the feeding pipe, of the surface of the bearing plate, and a sleeve frame is fixedly installed in the middle of the surface of one end of the lower mold frame. According to the PCBA low-pressure injection molding device, the butt joint structure is matched with the clamping assemblies which are correspondingly arranged up and down, so that the butt joint of the upper mold frame and the lower mold frame can be more stable, the influence of vibration on mold core alignment in the low-pressure injection molding process is avoided, meanwhile, the mold core can be abutted by utilizing the screw rotating structure on the surface of the sleeve frame, and |
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