Chip on film structure, display panel and display device
The utility model discloses a chip-on-film structure, a display panel and a display device, the chip-on-film structure comprises a flexible substrate, at least two chips and a plurality of binding pins, at least one chip is arranged on one surface of the flexible substrate, and at least another chip...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a chip-on-film structure, a display panel and a display device, the chip-on-film structure comprises a flexible substrate, at least two chips and a plurality of binding pins, at least one chip is arranged on one surface of the flexible substrate, and at least another chip is arranged on the other opposite surface of the flexible substrate; the plurality of binding pins are arranged at one end part of the flexible substrate, and the projections of the binding pins on the flexible substrate are arranged in a structure of at least two rows; and each chip is connected with at least one binding pin. According to the technical scheme, by increasing the distance between the adjacent chip-on-film structures and the distance between the pins, the process capability of binding equipment is met, and the requirements of high-resolution and high-resolution display panels are met.
本申请公开一种覆晶薄膜结构、显示面板及显示装置,所述覆晶薄膜结构包括柔性衬底、至少两芯片及多个绑定引脚,至少其中一芯片设于所述柔性衬底的一表面,至少其中另一芯片设于所述柔性衬底相对的另一表面;多个所述绑定引脚设于所述柔性衬底的一端部 |
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