Repair-free connecting structure capable of easily adjusting wall thickness of mold
The utility model relates to a repair-free connecting structure capable of easily adjusting the wall thickness of a mold, which is characterized in that at least one film-shaped metal paper layer with the thickness of 0.02-0.03 mm and high temperature resistance of more than 660.4 DEG C is fixedly p...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a repair-free connecting structure capable of easily adjusting the wall thickness of a mold, which is characterized in that at least one film-shaped metal paper layer with the thickness of 0.02-0.03 mm and high temperature resistance of more than 660.4 DEG C is fixedly paved on a working tape surface, which needs to be thinned, of a mold and a flow guide plate, and is attached to the working tape surface. Filling the working tape of the die with aluminum foil and tin foil, and reducing the gap of the working tape so as to reduce the wall thickness of the extruded profile; the surface of the aluminum foil and the tin foil is smooth and soft without generating defects such as lines, coarse lines and strain, so that the surface quality of the extruded profile is qualified; the die working tape is directly filled with aluminum foil and tin foil, the original material of die steel is not damaged, and the service life of the die is prolonged; the operation is simple, and the aluminum fo |
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